APAK Material Ltd.

APAK Enterprises Inc.

APAK PKG

IC Assembly Solutions

Your Trusted Partner in Advanced Technology

IC封裝解決方案

您值得信賴的先進技術夥伴

About Us

Your Trusted Partner in IC Assembly Solution

With over 20 years of experience in the IC assembly market in Taiwan, APAK Material Ltd. & APAK Enterprises Inc. stand out as a leading agent specializing in high-quality IC assembly solutions. Our extensive expertise, rooted in our team's background at ASMPT Sales, enables us to deliver exceptional products and services.

Our Expertise

Industry Knowledge: Based on our extensive experience, we have a deep understanding of our customers' technical needs.
Quality Assurance: We cooperate with excellent vendors that provide suitable products that meet your needs.
Customer-Centric Approach: We prioritize your needs and satisfaction.

關於我們

您值得信賴的IC封裝解決方案夥伴

在台灣IC封裝市場擁有超過20年的經驗，弘鼎材料科技有限公司與元泰亨企業有限公司是專精於高品質IC封裝解決方案的領先代理商。我們豐富的專業知識，源自於團隊在ASMPT銷售部門的背景，使我們能夠提供卓越的產品和服務。

我們的專業能力

行業知識：基於我們豐富的經驗，深刻理解您的技術需求。
品質保證：與優秀的供應商合作，提供符合您需求的產品。
以客為尊：我們優先考慮您的需求和滿意度。

Our Products

We strive to be your go-to partner for all IC assembly needs.

IC Lead Frames

Customized IC Lead Frame Solutions

Stamped or etched frames from ROKKO (SG), JIEXIN (CN), and WISE (CN), paired to demand.

Jig Saw + AOI + PNP

Integrated Jig Saw / AOI / Pick & Place Systems

Jig Saw, AOI & Pick & Place from ROKKO, driven by DISCO saw engine.

Die Bonder

High-Performance Die Bonder Solutions

Supplied by M.S.C. Industry (CN), matching the performance and stability of industry leaders while maximizing value.

MIS Substrate

SSP Substrate (Evolved MIS)

Substrate structure superior to MIS, enabling excellent wire bonding — a high-performance substrate solution.

Equipment Spare Parts

Boost Productivity with Spare Parts & Kits

Competitive pricing and flexible delivery for assembly test machine parts and conversion kits.

Conversion Kit

IC Premold Lead Frame

Optimized for RF and high-frequency applications, ensuring minimal loss and consistent performance.

產品介紹

我們致力於成為您所有IC封裝需求的首選夥伴。

IC導線架

多元供應的 IC 導線架解決方案

涵蓋沖壓與蝕刻框架，來源自 ROKKO（新加坡）、JIEXIN（中國）、WISE（中國）

治具鋸 + 自動光學檢測 + 貼放

半導體封裝設備解決方案：切割、視覺檢測與自動貼裝

切割、視覺檢測與 Pick & Place，由 ROKKO（新加坡）供應，採用 DISCO 切割引擎

晶片接合機

高性能晶片貼合設備

M.S.C. Industry（中國）提供，性能與穩定性媲美業界領先供應商，提供高性價比解決方案

MIS基板

次世代 SSP 基板解決方案

優於 MIS 的結構設計，提升打線流暢度與整體性能

設備零件

高 CP 值封測零件與套件

價格具競爭力、交期靈活，助您快速提升產能與效率

轉換套件

IC 預成型導線架

適用於射頻與高頻應用，確保訊號低損耗與穩定性能

Vision

Our Vision

Leading the future of IC assembly technology with innovation and excellence

我們的願景

以創新和卓越引領IC封裝技術的未來

Contact Us

Henry Fang

Henry.fang@apak.com.tw

Jerry Lien

Jerry.lien@apak.com.tw

聯絡我們

Henry Fang

Henry.fang@apak.com.tw

Jerry Lien

Jerry.lien@apak.com.tw